Advanced ceramic material for high power hybrid semiconductor packaging where high thermal conductivity is required. AlN substrates have a thermal conductivity of 170 W/Mk and available in standard thicknesses in sizes up to 100 mm (4") square.
Beryllium oxide is also commonly referred to as beryllia. This material is in high demand due to its superior performance at high temperatures along with thermal conductivity second only to diamond among insulating materials.
SiC substrates are formed using a proprietary CVD process, are extremely uniform, 5Ns pure, and 100% dense.
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